Embedded Computing Solutions
The Elma Electronic Systems group includes Embedded Computing Products and Services,
formerly known as ACT/Technico. For all product groups, visit elma.com
Tel.: 215-956-1200 :: Toll free: 800-445-6194 ::
The Elma Electronic Systems group includes Embedded Computing Products and Services,
formerly known as ACT/Technico. For all product groups, visit elma.com
Tel.: 215-956-1200 :: Toll free: 800-445-6194 ::
Configurable FPGA based I/O Solutions
| Altera based I/O Solutions | Xilinx based I/O Solutions |
 ECM PMC: Modular I/O on a PMC card |
Configurable High Performance I/O |
| Modular I/O PMC Product Overview |
3U VPX High Performance, Configurable Front End Processor for I/O
Model TIC-FEP-VPX3b
The TIC-FEP-VPX3b is a 3U VPX Front End Processing board based on the Xilinx Virtex®-6 FPGA. It offers very high performance REM with low power consumption. Designed for applications requiring a very high level of computing power in a compact 3U form factor, the TIC-FEP-VPX3b board combines the flexibility of a Virtex-6 FPGA with the VPX high bandwidth serial interfaces. An FMC mezzanine site expands the capability of the board to connect ADC, DAC, general I/O, video, sFPDP, or additional FPGA based FMC modules.
As part of our 3U VPX range, the TIC-FEP-VPX3b, along with our Intel®
and Freescale SBCs and our XMC carriers for IO boards, provides the
ideal platform for radar, sonar, electronic warfare, and other digital signal
processing applications.
Features:
- Processing Unit
• Xilinx Virtex-6 XC6VSX315T (or XC6VLX195T)
• Two banks of DDR3-800
• Optional pipelined NoBlocking SRAM
• Spartan®-6 LX-25T (control Node) - VPX Interfaces
• Four 4-lane Fabric ports
• Four GTX x4 channel (Fat Pipes A, B, C & D)
• General purpose IOs
• Sixteen differential pairs (from FPGA)
• Sixteen differential pairs (from FMC IOs connector)
• GPIOs user-defined on P1 - FMC interfaces
• One GTX x4 link
• 68 Differential Pairs
• Four Reference Clocks
• Eight Single Ended I/O
Miscellaneous
• PIC μ-controller for System Management (per VITA 46.11)
• Four LEDs
• Four switches for on-board user configuration
Accessories
• Engineering kit : JTAG ports for FPGA direct configuration
Also available as a bundle with operating systems, storage, and transition I/O. E-mail us for details.
- Build your own custom PMC I/O board by mixing and matching modular components
- Highly configurable and off the shelf
- FPGA based modules
- Incorporate multiple functions on a single board
- Fast reconfiguration by exchanging modules and reprogramming
- Design and build application specific solutions
- -40c to+85c operating temperatures
- Conduction cooled versions
Configurable PMC I/O Solutions provide a flexible architecture that allows designers to create customized board level I/O solutions using off the shelf modular components that can be assembled to deliver thousands of I/O combinations. Build I/O systems that are virtually obsolescence proof by using a common set of components and at the same time reduce the high costs and long lead times typical in product development cycles.
Configurable I/O solutions allow system designers to move rapidly from prototype to production using FPGA based PMC carrier cards (IEEE-P1386.1 compliant) and a wide selection of 1.25" square electrical conversion modules (ECMs). All Configurable I/O products perform at _40C to + 85C operating temperatures. Conduction cooled versions available. Contact Elma about individual data sheets. Consider combining your Configurable PMC I/O with a single board computer for a fully integrated board level bundle in VME or CompactPCI.
As an example, build a PMC solution around a 16K logic element FPGA carrier card (model 8063G) and a combination of a pair of 8 bit DIO ECMs (model 14) plus a pair of RS232 and RS422 I/O ECMs (model 11) or select four different ECMs.
|
|
|
|
The ECM carrier is the heart of the Configurable I/O PMC system. It is the place that holds and executes the resident IP core design and it carries out the various processing and I/O functions as defined by the custom I/O system design. Choose from three carrier variants based on FPGA logic element (LE) density; 16K, 20K and 37K. A conduction cooled 16K LE carrier is also available for rugged applications.
ECM Carriers
Model Number
Description
Model Number
Description
8062G
ECM Carrier, PMC Format -- LOW LEVEL ECM carrier, Cyclone II, 20K LE
8064G
CONDUCTION COOLED ECM Carrier, PMC Format -- MID LEVEL ECM carrier, Cyclone III, 16K LE
8063G
ECM Carrier, PMC Format -- MID LEVEL ECM carrier, Cyclone III, 16K LE
8069G
ECM Carrier, PMC Format -- HIGH LEVEL ECM carrier, Cyclone II, 35K LE
ECM Modules
Model Number
Description
Model Number
Description
01
ECM, Analog -- 4 channel, high common mode comparator
11
ECM, Interface -- 8 I/O with selectable termination, RS485 / RS422
02
ECM, Analog -- 4 channel DAC with multiple standard outputs
12
ECM, Interface -- 8 I/O with fixed termination, RS485 / RS422
03
ECM, Analog -- 8 channel ADC, medium resolution/speed
13
ECM, Interface -- 4 input / 4 output, RS-232
04
ECM, Analog -- 2 channel power H bridge 2 channel, 1 amp drive
14
ECM, Digital -- 8 bits DIO with ground per signal, CMOS
05
ECM, Analog -- 2-channel ADC, Delta-Sigma, high resolution, low speed
15
ECM, Digital -- 16 bits DIO, CMOS
06
ECM, Analog -- 2 channel ADC, medium resolution/speed, differential input
16
ECM, Memory -- Dual microSD memory card adapter
07
ECM, Analog -- 8 channel Current Comparator, Current Sense, 4-to-20 mA Loop Sense
17
ECM, Clock -- Precision, adjustable clock source, CMOS, LVDS, sine wave
08
ECM, Analog -- 8 x 8 Crosspoint Switch
18
ECM, Miscellaneous -- Socket saver
09
ECM, Interface -- 3 output / 5 input RS-232
19
ECM, Audio -- Dual Stereo Codec ECM based on TLV320AIC23BIPWR chipset. Line level in/out.
10
ECM, Interface -- 4 channel I2C with rise time enhancement, CMOS
20
ECM, Interface -- 8 Channel Low Voltage Differential Signaling (LVDS)